Welcome to aiXscale Photonics,

                     your solution provider for PIC and transceiver packaging

Uniquely enabled by waferscale precision glass molding technology, aiXscale Photonics supplies proprietary ultra-high precision optical glass interposer solutions for reliable, low loss and cost effective assembly of transceiver optical subassemblies and co-packaged optics. We serve the needs of current and next generation high-volume Datacom and Telecom applications.

Want to make your custom Photonic Integrated Circuit (PIC) a plug & play device? We provide scalable and low cost optical interfacing to a standard MPO connector.

aiXscale Photonics was founded in 2017 by Jeremy Witzens and Florian Merget as a spin-off from the Institute of Integrated Photonics of RWTH Aachen University, Germany.


Customer Value

Custom DesignWe adapt our proprietary glass interposer technology to your application specific needs.

IP-protectionaiXscale Photonics’ proprietary glass interposer technology does not require knowledge of the PIC-design. Your IP remains protected.

Scalable production aiXscale Photonics packaging solutions build on waferscale molding and pick-and-place assembly, aimed at large volume production.



Please contact us for further information. We would be happy to discuss how we can help advance your application.





Jeremy Witzens
CEO & Founder


Florian Merget
Dir. of Engineering & Founder