Welcome to aiXscale Photonics,
your solution provider for PIC and transceiver packaging
Uniquely enabled by waferscale precision glass molding technology, aiXscale Photonics supplies proprietary ultra-high precision optical glass interposer solutions for reliable, low loss and cost effective assembly of transceiver optical subassemblies and co-packaged optics. We serve the needs of current and next generation high-volume Datacom and Telecom applications.
Want to make your custom Photonic Integrated Circuit (PIC) a plug & play device? We provide scalable and low cost optical interfacing to a standard MPO connector.
aiXscale Photonics was founded in 2017 by Jeremy Witzens and Florian Merget as a spin-off from the Institute of Integrated Photonics of RWTH Aachen University, Germany.
Custom Design – We adapt our proprietary glass interposer technology to your application specific needs.
IP-protection – aiXscale Photonics’ proprietary glass interposer technology does not require knowledge of the PIC-design. Your IP remains protected.
Scalable production – aiXscale Photonics packaging solutions build on waferscale molding and pick-and-place assembly, aimed at large volume production.
Please contact us for further information. We would be happy to discuss how we can help advance your application.