Welcome to aiXscale Photonics
your solution provider for PIC and transceiver packaging
aiXscale Photonics GmbH has entered into a definitive agreement to be acquired by Astera Labs Inc., a company whose vision and values align closely with ours. The aiXscale Photonics team looks forward to working with Astera Labs to complete the transaction and, once closed, to support Astera Labs’ deployment of optical scale-up connectivity solutions. Please see the related press release.
Uniquely enabled by waferscale precision glass molding technology, aiXscale Photonics supplies proprietary ultra-high precision optical glass interposer solutions for reliable, low loss and cost effective assembly of transceiver optical subassemblies and co-packaged optics. We serve the needs of current and next generation high-volume Datacom and Telecom applications.
Want to make your custom Photonic Integrated Circuit (PIC) a plug & play device? We provide scalable and low cost optical interfacing to a standard MPO connector.
aiXscale Photonics was founded in 2017 by Jeremy Witzens and Florian Merget as a spin-off from the Institute of Integrated Photonics of RWTH Aachen University, Germany.
Customer Value
Custom Design – We adapt our proprietary glass interposer technology to your application specific needs.
IP-protection – aiXscale Photonics’ proprietary glass interposer technology does not require knowledge of the PIC-design. Your IP remains protected.
Scalable production – aiXscale Photonics packaging solutions build on waferscale molding and pick-and-place assembly, aimed at large volume production.
Please contact us for further information. We would be happy to discuss how we can help advance your application.
